Intel CES 2019 Roundup

Published by Travis G

Lakefield CPU’s are on the way with Intel showing off their latest Foveros 3D packaging technology, it allows Intel to stack their various technologies on one chip this in turn allows for a more compact design, Lakefield is expected to be in production this year.

The 9th Gen Intel Core group is being expanded as Intel bring new additions. The first of the new 9th Gen Intel Core desktop processors is expected to be available starting this month.

10nm server processors are coming, Intel ice lake Xeon CPU’s that are compatible with the upcoming 14nm Cooper Lake, with shipments targeted for 2020.

5G, the next generation of mobile signal is also a big focus for Intel with 10nm SoCs, code-named “Snow Ridge” and developed specifically for 5G wireless access and edge computing. Snow Ridge is expected to be available in the second half of this year.

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